Fully Automatic CMP Device 'MGP-808XJ'
Dry in / dry out is possible! Equipment for mirror finishing of silicon wafers.
The "MGP-808XJ" is a fully automatic CMP device that is the successor to the Lap Master SFT's "LGP-808XJ." It adopts a newly developed head from our company, achieving improvements in GBIR and SFQR on the wafer surface. The transport method is either edge clamp or edge contact. Additionally, it allows for dry in/dry out capabilities through integration with a cleaning machine. 【Features】 ■ Successor model to the Lap Master SFT's "LGP-808XJ" ■ Achieves improvements in GBIR and SFQR on the wafer surface ■ High throughput with 8 polishing heads and 3 polishing plates ■ All transport systems utilize either edge clamp or edge contact methods ■ Allows for dry in/dry out capabilities through integration with a cleaning machine *For more details, please refer to the PDF document or feel free to contact us.
- Company：ミクロ技研 本社
- Price：Other
